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The CD4MCu alloy is nominally a 26Cr-6Ni alloy (C ≤ 0.04), with the addition of molybdenum and copper. There is no corresponding wrought steel grade for this alloy. The alloy CD-4MCu has a duplex structure in the as-cast state, which is composed of austenite distributed in a ferrite matrix. Although the precipitation of carbides is limited by the minimum carbon content of the alloy, if not eliminated by solution treatment, it will also disperse in the ferrite matrix, thus reducing the corrosion resistance. The solution treatment temperature of CD-4MCu is 1120°C, and it should be held for at least two hours to ensure uniform temperature. Then it is slowly cooled to 1010~1065°C and held for half an hour, followed by quenching. Holding at a lower temperature is to prevent the casting (especially the casting with a thicker section) from cracking during quenching. The structure after heat treatment is also duplex, with 35~40% austenite in the ferrite matrix.
Chemical element composition content (%)
Component | C | Si | Mn | P | S | Cr | Ni | Cu | Mo |
Minimum value | - | - | - | - | - | 24.5 | 4.75 | 2.75 | 1.75 |
Maximum value | 0.04 | 1 | 1 | 0.04 | 0.04 | 26.5 | 6 | 3.25 | 2.25 |
Available Product Forms of CD4MCU Alloy
CD4MCU provides the following standard specification materials:
CD4MCU stainless steel plates, including medium and thick plates as well as thin plates (For fixed lengths, please refer to the strip materials).
Supply status: Hot-rolled plates, cold-rolled plates, solution-treated, and pickled.
CD4MCU circular plates or rings
Supply status: Hot-rolled or forged materials, solution-treated, pickled or machined.
CD4MCU copper forgings
In addition to circular plates, rings, round bars, and bars, forgings in irregular shapes can also be provided upon request.
CD4MCU copper strips
Supply status: Cold-rolled and annealed, or solution-treated, pickled or bright annealed.
CD4MCU alloy wires
Supply status of CD4MCU alloy: Brightly drawn and bright annealed.
Specifications: Diameter Φ0.01-12.7mm, supplied in coils, packaged in barrels, on reels or rolled up.
Welding filler materials
The alloy can provide rod-shaped, wire-shaped, and strip-shaped electrodes with good weldability in all specifications, as well as electrode core materials.
CD4MCU seamless pipes and welded pipes are in stock. The outer diameter of the billets is Φ10-520. Conventional specifications are available in stock.
CD4MCU alloy bars available
Supply status of CD4MCU alloy: Forged materials, rolled materials, cold-drawn bright round materials, solution-treated, pickled, and machined.
The CD4MCU alloy, CD-4MCu, is nominally a 26Cr-6Ni alloy (C ≤ 0.04), with the addition of molybdenum and copper. There is no corresponding wrought steel grade for this alloy.
The alloy CD-4MCu has a duplex structure in the as-cast state, which is composed of austenite distributed in a ferrite matrix. Although the precipitation of carbides is limited by the minimum carbon content of the alloy,
if it is not eliminated by solution treatment, it will also disperse in the ferrite matrix, thus reducing the corrosion resistance. The solution treatment temperature of CD-4MCu is 1120°C, and it should be held for at least two hours,
to ensure uniform temperature. Then it is slowly cooled to 1010~1065°C and held for half an hour, followed by quenching. Holding at a lower temperature
is to prevent the casting (especially the casting with a thicker section) from cracking during quenching. The structure after heat treatment is also duplex, with 35~40% austenite in the ferrite matrix.
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